National

Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.

Sample of reported job titles: Wafer Fabrication Operator, Fabrication Operator, Process Technician, Diffusion Operator, Engineering Technician, Manufacturing Technician, Device Processing Engineer, Manufacture Specialist, Metalorganic Chemical Vapor Deposition Engineer (MOCVD Engineer), Probe Operator

Tasks

• Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
• Maintain processing, production, and inspection information and reports.
• Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
• Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
• Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
• Load and unload equipment chambers and transport finished product to storage or to area for further processing.
• Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
• Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
• Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
• Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.